Multi-channel Fiber Optic Constant-Current Driver Test System

Characteristics

Description

High power density and scalability

The total power supply capacity is ≥600 kW, and the total load exceeds 1 MW. The system features a modular design that supports flexible expansion of both channels and power capacity.

Real Load Simulation

Configure a 200-channel analog load based on SOT-227‑packaged diodes to accurately replicate the true electrical and thermal characteristics of an optical fiber load.

High-precision multi-channel data acquisition

It features simultaneous acquisition of 110 voltage channels and 110 current channels at a sampling rate of ≥1 Msps, and, when paired with a 1‑GHz bandwidth oscilloscope, enables high‑resolution waveform analysis.

Automated Testing and Analysis

The integrated host‑computer software supports test sequence editing, one‑click testing, real-time monitoring, waveform comparison, automatic report generation, and historical data retrieval and analysis.

Comprehensive thermal management

Liquid-cooling systems with a total cooling capacity of ≥200 kW ensure thermal stability under demanding operating conditions for high-power loads.

Integration and Maintainability

The system features cabinet‑integrated design, with all modules supporting pull‑out and quick‑connect interfaces, and is equipped with casters for easy deployment, operation, and replacement.

Module Name

Key Parameters and Specifications

Function Overview

Programmable DC Power Supply System

Single-unit output: 10–750 V, ≥126 kW
Voltage Ripple: ≤2V @ 400V (RMS)
Transient recovery time: ≤10 ms
Overshoot Voltage: ≤35V @ 400V
Modularity: Composed of three 42 kW/3U hot-swappable modules connected in parallel.

Provides a high-precision, high-power, programmable DC input for the current‑regulated driver under test.

DC electronic load system

Racks: 5 units, each equipped with Electronic Load 1 (5 channels) and Electronic Load 2 (5 channels).
Electronic Load 1 (Low Voltage): 0–20 V / 0–35 A, ≥300 W per channel, with a total of 25 channels.
Electronic Load 2 (High Voltage): 0–300 V / 0–60 A, ≥5 kW per channel, with a total of 25 channels.
Operating modes: CC/CV/CR/CW and various combined modes
Cooling: Air-cooled

Perform dynamic stress testing under load conditions that simulate a wide range of voltage and current characteristics.

DC Analog Diode Load System

Cabinets: 5 units, each equipped with 20 low-voltage channels and 20 high-voltage channels.
Low-Voltage Load 1 (1–8 V): 1–8 V, 0–15 A per channel, with a total of 100 channels.
High‑voltage load 2 (130±20 V): 110–170 V, 0–40 A per channel, with a total of 100 channels.
Core component: Fast-recovery diode in SOT-227 package (400 V/100 A)
Cooling: Liquid cooling; under full‑power intermittent operation (5 min on/5 min off), the diode case temperature is ≤85°C.

Based on a real diode array, it accurately simulates the characteristics of fiber‑optic loads, enhancing the representativeness of test results.

Multi-channel Voltage and Current Networked Acquisition System

Voltage Acquisition: 110 channels, 0–200 V, sampling rate ≥ 1 Msps, accuracy ±2%
Current Acquisition: 110 channels, 0–40 A, sampling rate ≥ 1 Msps, accuracy ±2%
Oscilloscopes: 5 units (total of 20 channels), ≥1 GHz bandwidth, ≥12-bit vertical resolution
Sampling converters: 20 units, enabling polling-based switching between over 200 channels and 20 oscilloscope channels.
Architecture: Networked Data Acquisition Based on Matrix Switching and Network Communication

High-precision, high-bandwidth acquisition of voltage and current signals from the power supply output, for waveform and parameter analysis.

Automated Testing and Analysis Software Platform

Functions: test process control, parameter configuration, real-time monitoring, one-click testing, waveform analysis, report generation, data archiving, and traceability analysis.
Hardware platform: High-performance industrial PC, with ≥10 TB of local storage.

The system’s control hub and data analytics center enable the automation and intelligent optimization of testing workflows.

Auxiliary Measurement and Safety Monitoring Module

Thermal imaging system: resolution 1024×768, sensitivity ≤30 mK at 30°C, used for real-time monitoring of temperature rise in critical components.
Power semiconductor tester: capable of 1700 V/1000 A testing, used for static and dynamic parameter characterization of devices such as IGBTs and MOSFETs.

Provides device-level performance evaluation and visualized analysis of system thermal stability, ensuring test safety.

High-power water-cooled chiller unit

Total cooling capacity: ≥200 kW
Temperature control range: 25°C ± 5°C
Configuration: 5 mobile water-cooling units, supporting quick‑connect liquid‑cooling interfaces.

Provides stable and efficient thermal management for high-power analog diode loads and electronic loads, ensuring system thermal stability.

Project

Specifications

Power Supply Requirements

AC 380V ±10%, three-phase five-wire, 50 Hz; AC 220V ±10%, single-phase, 50 Hz (auxiliary equipment)

Ambient temperature

Operating: 15°C to 30°C; Storage: -10°C to 50°C

Relative humidity

≤80% RH, no condensation

Cooling method

Power supplies and electronic loads: air-cooled; diode loads: water-cooled (supplied by the system’s water‑cooling unit)

System Dimensions and Weight

Multi‑cabinet configuration; the maximum dimensions of a single cabinet are approximately 1700×1153×1768 mm, with the total weight to be determined based on the specific configuration.

Safety standards

Equipped with overvoltage, overcurrent, overheating, short-circuit, and leakage protection, as well as grounding protection and an emergency stop device.